Description
MB102 830 Points Solderless Breadboard
Ideal for high frequency and low noise circuits
Interconnect any components with 20-29 AWG(0.3-0.8 mm) wire
Special designed spring clip over 5,000 insertion cycles
Nickel plated, silver plated and gold plated available
Specifications:
1 x MB102 830 Points Solderless Breadboard
Ideal for high frequency and low noise circuits
Interconnect any components with 20-29 AWG(0.3-0.8 mm) wire
Special designed spring clip over 5,000 insertion cycles
Nickel plated, silver plated and gold plated available
Specifications:
- 830 points
- Size: 16.5 x 5.4 x 0.9 cm
- Net weight: 77 g
- Package weight: 97 g
- Color: As shown in the pictures
1 x MB102 830 Points Solderless Breadboard